A NYР“РѓK lapok tulajdonkР“В©ppen kР“СlР“В¶nbР“В¶zР•вЂ maratР“РЋsi technolР“С–giР“РЋk Р“РЋltal kialakР“Вtott hordozР“С–eszkР“В¶zР“В¶k, kР“СlР“В¶nfР“В©le elektronikai alkatrР“В©szek szР“РЋmР“РЋra.

A nyomtatott Р“РЋramkР“В¶rР“В¶k olyan mechanikai kapcsolР“С–dР“РЋsi alapot jelentenek az elektromos komponenseknek, ahol az egyes elektronikai alkatrР“В©szeket vezetР•вЂkР“В©pes nyomvonalak kР“В¶tik Р“В¶ssze. A NYР“РѓK, vagy nyomtatott Р“РЋramkР“В¶r gyР“РЋrtР“РЋs az elektronikai ipar alapja. A technolР“С–gia rohamos fejlР•вЂdР“В©sР“В©vel mР“РЋr a legegyszerР•В±bb mР•В±szaki cikkekben lР“В©vР•вЂ NYР“РѓK lapoknak is a lehetР•вЂ legjobb minР•вЂsР“В©gР•В±nek kell lenniР“Сk, ezР“В©rt a fejlett gyР“РЋrtР“РЋsi folyamatoknak Р“В©s a gyР“РЋrtott termР“В©keknek szigorР“С” minР•вЂsР“В©gi, villamossР“РЋgi Р“В©s kР“В¶rnyezetvР“В©delmi elР•вЂР“ВrР“РЋsoknak kell megfelelniР“Сk (Khandpur, 2005). Annak Р“В©rdekР“В©ben, hogy ezen erР•вЂsen megnР“В¶vekedett keresleti oldallal a gyР“РЋrtР“С–k meg tudjanak birkР“С–zni, mindenkР“В©pp szР“СksР“В©ges tovР“РЋbb fejleszteni a meglР“В©vР•вЂ NYР“РѓK gyР“РЋrtР“РЋsi technolР“С–giР“РЋkat Р“В©s berendezР“В©seket (Tempo, 2020). Egyes iparР“РЋgakban, mint pР“В©ldР“РЋul a repР“СlР•вЂgР“В©piparban, orvostechnikР“РЋban vagy az autР“С–iparban megnР•вЂtt a funkcionalitР“РЋs Р“В©s a kiterjedt kР“В©pessР“В©gek irР“РЋnti kereslet. Az okos eszkР“В¶zР“В¶k elterjedР“В©sР“В©nek kР“В¶vetkezmР“В©nyekР“В©pp Р“В©letР“Сnk minden terР“СletР“В©n megtalР“РЋlhatР“С–k az elektronikai berendezР“В©sek, melyek alapja a nyomtatott Р“РЋramkР“В¶r. The primary results show an acceptable temperature rise for high current (18A) inductor without the heat sink.Р”Р„ nyomtatott Р“РЋramkР“В¶rР“В¶k (NYР“РѓK) irР“РЋnti igР“В©ny az utР“С–bbi Р“В©vekben tovР“РЋbb nР“В¶vekedett, melyet rР“В©szben a fogyasztР“С–i szokР“РЋsok vР“РЋltozР“РЋsa idР“В©zett elР•вЂ. An optimized design to achieve high efficient inductor and simultaneously high power density is proposed and several experiments and accurate designs are shown. First, parameter calculation for design consideration of an embedded inductor are presented, then JMAG simulations are used to observe precisely the temperature rise profile distribution in different sections of the inductor. Other challenges such as temperature rise optimization of high current (18A) on the PCB is also investigated. This will bring the advantage of lower resistivity and consequently the conduction loss. In addition, thermal restrictions are considered at high current capacity by reducing the inductor size. The toroidal structure due to its better performance on interfacing electromagnetic fields (EMI), is investigated. This paper presents the design and implementation of high power density and highly efficient air-core embedded inductor onto Printed Circuit Board (PCB) for 280W-5A/240nH, 280W-12A/150nH and 280W-18A/50nH. The TDR measurements reveal that the impedance variation is less than 3 for a 50 microstrip and S11 better than -9 dB for the frequency range 1 GHz to 6 GHz when the width changes from 165 to 940, and substrate thickness changes from 100 to 500.

To verify the concept, several microstrips were designed on multilayer FR4 PCB without any additional manufacturing steps.

A step change in substrate thickness is utilized to cancel the effect of the width discontinuity, thus achieving a reflection-free microstrip. This narrow-to-wide transition in width results in impedance discontinuity. In this paper, we propose the use of narrow tracks close to chip and wide tracks away from the chip. Such a transmission line is very hard to design due to the difference in on-chip and on-board feature size and the requirement for extremely large bandwidth. To cope with this requirement, we need reflection-free transmission lines from an on-chip pad to on-board SMA connectors. Connecting a large number of high-speed I/Os to the outside world with good signal fidelity at low cost is an extremely challenging task. ABSTRACT The pad pitch of modern radio frequency integrated circuits is in the order of few tens of micrometers.

Pc1d research paper